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FIZIKA A 15 (2006) 1 , 35-50
 
ON THE APPLICABILITY OF DIFFERENT METHODS OF XRD LINE PROFILES ANALYSIS
IN ESTIMATING GRAIN SIZE AND MICROSTRAIN IN TUNGSTEN THIN FILMS
IGOR DJERDJa1 ANĐELKA TONEJCa, ANTUN TONEJCa
and NIKOLA RADIĆb
aE-mail address: idjerdj@phy.hr
aDepartemnt of Physics, Faculty of Science, University of Zagreb,
Bijenička 32,
P. O. Box 331, HR-10002 Zagreb, Croatia
bRuđer Bošković Institute, Bijenička c. 54, P.O.Box 180, HR-10002, Zagreb, Croatia
Received 21 October 2004; revised manuscript received 24 May 2005
Accepted 12 September 2005 Online 10 November 2006
Different methods of X-ray diffraction line profile analysis
(XRDLPA) are used to study microstructural parameters such as
crystallite size (diffracted domain size), microstrain and
texture in tungsten thin films deposited on glass by DC magnetron
sputtering at different substrate temperatures and at different
working-gas pressures. The whole-pattern analysis within the
Rietveld method, the "single-line" method and "double Voigt"
method (equivalent to the Warren-Averbach method) are applied
and mutually compared. In addition, the results obtained by the
Scherrer method are also discussed. The line broadening has been
found to be isotropic, supporting the reliability of usage of
the Rietveld method in the size-microstrain extraction.
PACS numbers: 68.55.-a, 61.72.Dd,
UDC 538.975, 539.26
Keywords: tungsten thin film, X-ray diffraction, grain size, microstrains
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